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Nov 14-17, 2006
Electronica 2006
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April 19-21, 2006
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Dec 16, 2005
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Embedded Technology 2005
 
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S1N-PGFCS-05-GP
Model Name: S2N-PGKHS-05-GP
Application: 2U+ form factor system passive solution
CPU Type: Intel Xeon (Dempsey, Woodcrest, Clovertown)
Socket type: LGA 771
Heat Sink: Copper base + AL. stacked fin + heat pipe x 3
Cooler Dimension: 89 x 79 x 51mm
Interface Material: Shin Etsu X23-7783
ECC-00201-02-GP

Model Name: EBN-41FCS-01-GP
Application System: Embedded Aactive Solution
CPU Type: Intel Pentium M/Celeron M
(Banias/Dothan/Sossaman/Yonah)
Socket type: Micro-FCBGA(On board)
Cooler Dimension: 50 x 50 x 45 mm
Fan Type: 40x40x10, 5.3CFM at 5,500 RPM, 12V, 3 pins